Tokuyama Universal Bond II

Tokuyama Universal Bond II is a two-component, self-curing dental adhesive for direct and indirect restorations. Mixing Bond A and Bond B starts polymerization; applying the mixture as a…

Registry build 21.09.26

Tokuyama Universal Bond II is a two-component, self-curing dental adhesive for direct and indirect restorations. Mixing Bond A and Bond B starts polymerization; applying the mixture as a thin layer and air-drying concentrates it to form the adhesive layer.

The system is compatible with light-cured, self-cured and dual-cured composite materials and can be used with self-etch, selective-enamel-etch or total-etch techniques. Its uses include restoration bonding, intraoral repair, resin-cement attachment and bonding core build-ups.

Listed Item

Sample Kit

Components and Supply

Bond A and Bond B are packaged separately in plastic bottles to keep the reactive components apart during storage. The adhesive contains methacrylate monomers, solvents, a silane coupling agent and a chemical catalyst system, and is supplied nonsterile.

6manufacturers in China registered for this device type
4catalogue numbers in this listing
3510(k) clearances naming this product code

Who Else Makes It

Concentrated in Jilin (2), Liaoning (1), Guangdong (1).

Chinese manufacturers registered for FDA product code KLE
Manufacturer City Province Registered as Device types
Liaoning Upcera Co., Ltd. Benxi Liaoning Contract manufacturer 10
Shenzhen Upcera Digital Dental Technology Co., Ltd. Shenzhen Guangdong Exporter 10
Rizhao Huge Biomaterials Company, Ltd. Rizhao Shandong Manufacturer 7
CAO (China) Medical Equipment Company, Limited Langfang Hebei Contract manufacturer 6
Sincera Technology (Changchun) Co., Ltd. Changchun Jilin Manufacturer 2
Sino-Dentex Co., Ltd. Changchun Jilin Manufacturer 2

Record

Regulatory record for Tokuyama Universal Bond II
Listed by Tokuyama Dental Corporation, United States
FDA product code KLE
Device type Agent, Tooth Bonding, Resin
Device class Class 2
Regulation 21 CFR 872.3200
510(k) K203760
Record published 2021-06-30
Record revised 2024-02-16 (version 2)

Specifications

Specifications
MRI safety Labeling does not contain MRI Safety Information
Prescription Prescription only
Supplied as a kit Yes
Label carries lot or batch number, expiry date
Storage Storage environment temperature 0 to 25 °C

Catalogue Numbers

Catalogue numbers for Tokuyama Universal Bond II
Catalogue number Size Status
15329 In distribution
15320 In distribution
15310 In distribution
15315 In distribution

Same Product Code

Other products under the same FDA product code
Product Sold by Catalogue numbers
Epic® Parkell, Inc. 22
All-Bond Universal Bisco, Inc. 18
Henry Schein Henry Schein, Inc. 16
Peak Universal Bond Ultradent Products Inc. 16
Brush&Bond® Parkell, Inc. 16
All-Bond 2 Bisco, Inc. 15
The Orthodontic Store Young Innovations Inc. 15
All-Bond 3 Bisco, Inc. 13
Scotchbond™ Universal 3M Deutschland GmbH 13
Select HV Etch w/BAC Bisco, Inc. 12
Prelude Danville Materials, LLC 12
Jade Dharma Research, Inc. 12

Showing 12 of 609. All products under Agent, Tooth Bonding, Resin

510(K) Clearances

FDA 510(k) clearances naming this product code
Clearance Decision date
K203760 2021-05-25
K171226 2017-11-28
K070215 2007-03-30

Source: U.S. FDA establishment registration and device listing records, public domain. Restructured for clarity and searchability. Not affiliated with or endorsed by the FDA. Records are records: nothing here is an offer of sale.

Where China Actually Supplies

Every device page names the company that lists it and the factories registered to make the same thing. These are the sections with the most of them.

5,100manufacturers registered in China
2,581device types they are registered for
340,248device records, each naming its maker
31provinces with a registered manufacturer